For Thermosetting Mold, Induction Heating Furnace, IC Mold, etc.

BESTHERMO

  • Bending and compressive strength
  • Chemicak resistance
  • Thermal insulating
  • Minimum permanent strain
  • Reduce lead time and energy
  • Mold homogenization temperature

LOSSNA-BOARD

  • Thermal insulating
  • Dimensional stability
  • Compression resistance
  • Compression creap properties
  • Arc resistance
  • Reduce lead time and energy
  • Mold homogenization temperature

(BESTHERNO, LOSSNA-BOARD are trademarks of Nikko Kasei Co., Ltd.)