For Soldering (SMT) Pallet

 

t = 3mm, 4mm, 5mm, 6mm, 8mm, 10mm in stocks, deliverable.

 

Features

  • Thermosetting resin insulates from surrounding heat.
  • No masking tape reduces process flows.
  • Light weight improves workability.
  • Min. 0.5mm thickness  for FPC reflow pallet.
  • ESD
  • Higher heat resistance than FR-4 for lead-free soldering.

Properties

Thickness 0.5~30mm
Max.Use Temp 350℃
Flexural Strength
480MPa(room temp.) 280MPa(200℃)
Surface Resistivity 1058Ω
Thermal Conductivity  0.55w/mk
Linear Thermal Ex. Coef.  RT→200℃ 1.0×10-5 

 

(NIKKO PALLET is a trademark of Nikko Kasei Co., Ltd.)