For Thermosetting Mold, Die, Induction Heating Furnace, IC Mold, etc.
BESTHERMO
- Bending and compressive strength
- Chemicak resistance
- Thermal insulating
- Minimum permanent strain
- Reduce lead time and energy
- Mold homogenization temperature
LOSSNA-BOARD
- Thermal insulating
- Dimensional stability
- Compression resistance
- Compression creap properties
- Arc resistance
- Reduce lead time and energy
- Mold homogenization temperature
(BESTHERNO, LOSSNA-BOARD are trademarks of Nikko Kasei Co., Ltd.)