For Thermosetting Mold, Die, Induction Heating Furnace, IC Mold, etc.

BESTHERMO

• Bending and compressive strength
• Chemicak resistance
• Thermal insulating
• Minimum permanent strain
• Reduce lead time and energy
• Mold homogenization temperature
  

LOSSNA-BOARD

• Thermal insulating
• Dimensional stability
• Compression resistance
• Compression creap properties
• Arc resistance
• Reduce lead time and energy
• Mold homogenization temperature

(BESTHERNO, LOSSNA-BOARD are trademarks of Nikko Kasei Co., Ltd.)